The right support.
At the right stage.

Turn your requirements into a device concept: functional blocks, interfaces, power architecture and the technical decisions that guide detailed development.

• Requirements into architecture: translate the intended functions, operating conditions and mechanical constraints into a practical hardware concept.
• Functional blocks: identify the processing, measurement, power, communication and protection functions required by the device.
• Interfaces and power paths: define how blocks connect, exchange signals and receive power, including key voltage levels and interface requirements.
• Technical choices: assess candidate approaches and critical components, identify dependencies and highlight assumptions that need validation.
• Concept handover: deliver a system block schematic and architecture notes for customer review before detailed schematic design.

Deliverables
System block schematic · interface definition · architecture notes

EMI/EMC-aware circuit design, simulations of key blocks and power-supply calculations covering current and voltage ripple, component stress and control-loop compensation.

• Circuit architecture: component selection, power rails, analog and digital interfaces, protection circuits and operating limits.
• EMI/EMC: filtering, decoupling, grounding strategy and interface protection considered at schematic level.
• Key-block simulation: simulations of critical circuit behaviour, with operating conditions, assumptions and model limitations documented.
• Power-supply calculations: inductor-current ripple, output-voltage ripple, component sizing and electrical stress across the specified operating range.
• Control-loop design: compensation calculations and stability assessment for regulated supplies where applicable.
• Design handover: schematics, component data and implementation constraints for PCB layout.
• Project libraries: VortaniX Technologies hardware development uses custom libraries developed and owned by VortaniX Technologies to support correct manufacturing and soldering; library ownership is retained by VortaniX Technologies.

Deliverables
Electrical schematics · BOM · calculation and simulation results

PCB layout targeting agreed IPC Class 2 or Class 3 requirements, with EMI/EMC, signal integrity, power integrity and thermal performance considered throughout the design.

• IPC requirements: design rules and fabrication notes aligned with the selected Class 2 or Class 3 requirements and applicable standards agreed with the customer and manufacturer.
• EMI/EMC: component placement, current-loop area, return paths, grounding, filtering placement and separation of sensitive and noisy circuits.
• Signal integrity: stack-up and controlled-impedance coordination, differential-pair routing, length matching and crosstalk-aware routing where required by the interfaces.
• Power integrity: power distribution, decoupling placement, current-carrying paths and voltage-drop considerations.
• Thermal integrity: heat-source placement, copper heat spreading, thermal vias and coordination with mechanical cooling provisions.
• Manufacturing readiness: design-rule checks and review of fabrication, assembly and test-access constraints before release.

Deliverables
Native PCB project · stack-up and design constraints · manufacturing outputs

Structured schematic and PCB reviews covering high-speed circuits, EMI/EMC, DFM, DFA and DFT, with findings ranked by criticality.

• High-speed and SI: impedance constraints, return paths, differential pairs, length matching and interface-specific layout rules.
• EMI/EMC, power and thermal: switching loops, grounding, filtering, decoupling, power routing and heat-dissipation provisions.
• DFM — design for manufacturing: clearances, drills, copper features and stack-up compatibility with the intended PCB process.
• DFA — design for assembly: component spacing, footprints, polarity markings and assembly access.
• DFT — design for test: test points, power-rail access, programming/debug interfaces and measurement accessibility.
• Actionable report: checklist results, marked-up findings, priorities and suggested corrections; the checklist is adapted to the project.

Deliverables
Completed review checklist · prioritised findings · recommended actions

Production-file preparation and full engineering support throughout the agreed manufacturing run: supplier communication, working-file review and responses to engineering queries (EQs).

• Release package: PCB fabrication files, drill files, BOM, pick-and-place data, fabrication and assembly drawings, and revision notes.
• Manufacturer coordination: direct technical communication with PCB fabricators and assembly partners throughout the production process.
• Working-file review: review of manufacturer-prepared CAM/working files, proposed stack-ups and relevant fabrication or assembly changes against design intent.
• Engineering queries: clarification and resolution of manufacturer EQs, with technical decisions recorded.
• Change control: assessment of proposed component substitutions or production changes and coordination of approval before implementation.
• Production follow-through: engineering support for issues raised during fabrication and assembly, through completion of the agreed run.
• Manufacturing payments: bare PCB fabrication, components and PCB assembly are paid by the client directly to the relevant manufacturer or supplier. Manufacturing payments do not pass through VortaniX Technologies.

Deliverables
Manufacturing package · reviewed working files · EQ responses and revision record

Basic bare-metal microcontroller firmware only: peripheral configuration, sensor readout, communications and simple control or measurement logic.

• Bare-metal implementation: firmware runs without an RTOS or operating system; the microcontroller platform is agreed for each project.
• Board-level setup: clock and GPIO configuration, timers, interrupts and peripheral initialisation required by the hardware.
• Peripheral interfaces: sensor readout and basic communication over the interfaces included in the agreed scope.
• Application logic: simple measurement, control and diagnostic functions for prototypes and basic embedded applications.
• Handover: source code, build and programming instructions, and notes on configuration and implemented functions.

Deliverables
Firmware source · build instructions · peripheral and interface documentation

Bring-up against a clearly documented test procedure. For devices developed entirely by VortaniX Technologies, the service also includes writing the procedure, defining pass criteria and executing the tests.

• Partially developed by VortaniX Technologies: bring-up is performed against a clearly written, agreed test procedure covering the device and the parts to be verified. This procedure must be available before testing starts.
• Fully developed by VortaniX Technologies: for devices taken from concept to physical hardware, the service includes writing the test procedure and defining measurable acceptance criteria.
• Initial checks: visual inspection, pre-power checks, controlled power-up and verification of power rails and current consumption as specified in the procedure.
• Functional tests: testing of the interfaces and functions defined in the procedure, with recorded operating conditions and measurements.
• Results: pass/fail assessment against the agreed limits, documented anomalies and recommended follow-up actions.
• Physical handover: all hardware received or released by VortaniX Technologies requires a handover and acceptance protocol signed by both parties.

Deliverables
Test procedure where included · measured results · pass/fail report and issue log

A standalone outsourced service for companies that need their own Altium component libraries created, customised or maintained to their internal requirements.

• Standalone library support: maintain your company’s Altium libraries as an independent assignment, separate from the VortaniX Technologies hardware-development flow.
• Client-defined parameters: custom fields, naming conventions, manufacturer and supplier data, electrical ratings and BOM-related properties.
• Schematic appearance: fully customised symbol graphics, pin arrangement, functional grouping and visible parameter placement to match your requirements.
• PCB footprints: pads, solder-mask and paste openings, component outlines and assembly markings checked against component documentation.
• 3D integration: association and alignment of available component models with the footprint.
• Library consistency: pin-to-pad mapping checks and updates to existing library entries using the agreed conventions.

Deliverables
Custom symbols and footprints · client-defined parameters · available 3D models